Chinese Journal of Lasers, Volume. 51, Issue 1, 0102001(2024)
Development of Refractory High Entropy Alloys by Laser Additive Manufacturing: Regulating Material Properties and Manufacturing Processes (Invited)
Fig. 1. Typical thermal cracks[35-37]. (a)(b) Solidification cracks with irregular dendritic morphology; (c)(d) liquefaction cracks without dendritic characteristics; (e)(f) solidification cracks; (g)(h) morphology and dislocation maps of the liquefaction crack region; (i)‒(k) single pass of LPBFed AA7075 alloy shows different pool shapes and thermal crack sensitivities
Fig. 4. High entropy alloy phase with high flux forming[74]. (a) XRD patterns; (b) measured composition versus predicted composition; (c) SEM image and elemental mapping
Fig. 5. Backscatter image of sample section and grain direction of welded structure section obtained by electron backscatter diffraction (EBSD)
Fig. 7. Cross-section morphology of thin-walled parts under different process parameters[84]. (a) 2.8 J/mm; (b) 3.2 J/mm; (c) 3.6 J/mm; (d) 4.0 J/mm; (e) 4.4 J/mm
Fig. 8. Performance test results of the samples under different processing parameters[84]. (a) Average microhardness of alloy cross-section; (b) engineering stress-strain curves of the alloy under compression at room temperature
Fig. 9. LPBF forming process and geometric relationship between parameters[72]. (a) Simplified LPBF forming process. Geometric relationship between the layer thickness c and the channel spacing d for the following cases: (b)
Fig. 10. Temperature distribution in the micro-region (4 mm×2 mm×1 mm) around the 200 s laser spot of LPBF process[92]
|
|
|
Get Citation
Copy Citation Text
Dichen Li, Hang Zhang, Jianglong Cai. Development of Refractory High Entropy Alloys by Laser Additive Manufacturing: Regulating Material Properties and Manufacturing Processes (Invited)[J]. Chinese Journal of Lasers, 2024, 51(1): 0102001
Category: laser manufacturing
Received: Sep. 15, 2023
Accepted: Nov. 13, 2023
Published Online: Jan. 19, 2024
The Author Email: Li Dichen (dcli@mail.xjtu.edu.cn), Zhang Hang (zhanghangmu@mail.xjtu.edu.cn)
CSTR:32183.14.CJL231215