Scratch Evolution for Monocrystalline Silicon During Chemical-Mechanical Polishing

Jingjing Xia; Jun Yu; Zhanshan Wang; Siwen Lu

doi:10.3788/AOS202242.0912002

Acta Optica Sinica, Volume. 42, Issue 9, 0912002(2022)

Scratch Evolution for Monocrystalline Silicon During Chemical-Mechanical Polishing

Jingjing Xia, Jun Yu^*, Zhanshan Wang, and Siwen Lu

Institute Precision Optical Engineering, School of Physics Science and Engineering, Tongji University, Shanghai 200092, China

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Jingjing Xia, Jun Yu, Zhanshan Wang, Siwen Lu. Scratch Evolution for Monocrystalline Silicon During Chemical-Mechanical Polishing[J]. Acta Optica Sinica, 2022, 42(9): 0912002

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Paper Information

Category: Instrumentation, Measurement and Metrology

Received: Sep. 26, 2021

Accepted: Nov. 22, 2021

Published Online: May. 6, 2022

The Author Email: Jun Yu (yujun_88831@tongji.edu.cn)

DOI:10.3788/AOS202242.0912002

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology