Chinese Optics Letters, Volume. 6, Issue 9, 669(2008)

Measurement of thermal expansion coefficient of nonuniform temperature specimen

Jingmin Dai1、*, Chunsuo Xin1, and Xiaowa He2
Author Affiliations
  • 1Department of Automation Measurement and Control, Harbin Institute of Technology, Harbin 150001
  • 2Aerospace Research Institute of Materials and Processing Technology, Beijing 100076
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    CLP Journals

    [1] Dapeng Chen, Zhi Zeng, Cunlin Zhang, Ning Tao, Zheng Zhang, "Air-coupled ultrasonic infrared thermography for inspecting impact damages in CFRP composite," Chin. Opt. Lett. 10, S10401 (2012)

    [2] Chunsuo Xin, Jingmin Dai, Xiaowa He, "Experimental study on electrical resistivity measurement of a specimen at high temperature," Chin. Opt. Lett. 7, 07585 (2009)

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    Jingmin Dai, Chunsuo Xin, Xiaowa He, "Measurement of thermal expansion coefficient of nonuniform temperature specimen," Chin. Opt. Lett. 6, 669 (2008)

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    Paper Information

    Received: Feb. 29, 2008

    Accepted: --

    Published Online: Sep. 11, 2008

    The Author Email: Jingmin Dai (djm@hope.hit.edu.cn)

    DOI:10.3788/COL20080609.0669

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