Fig. 1. Three-dimensional structure diagram of the detector

Fig. 2. Detector profile with Kovar equilibrium layer

Fig. 3. Multi-layer material structure system

Fig. 4. Warpage deformation of multi-layer material system

Fig. 5. Finite element mesh of module

Fig. 6. Without Kovar equilibrium layer (a) thermal deformation in low temperature, (b) thermal stress (z-axis downward is positive direction)

Fig. 7. With Kovar equilibrium layer (a) thermal deformation in low temperature; (b) thermal stress (z-axis downward is positive direction)

Fig. 8. Material layers composition of detector chip

Fig. 9. Comparison between adding Kovar equilibrium layer and not adding Kovar equilibrium layer (a) epilayer thermal stress of HgCdTe detector, (b) low temperature deformation of the centerline of detector chip surface

Fig. 10. On the detector chip (a) the curve of maximum thermal stress changing with thickness of Kovar equilibrium layer; (b) the curve of the deformation changing with the thickness of Kovar equilibrium layer