Research on the Fabrication and Application of 230 nm Far-UVC LED Packaging Device

Wenbo LI; Wentao LI; Leming TANG; Yong YANG; Qiming XU; Yanwei SHEN

doi:10.19453/j.cnki.1005-488x.2023.03.008

Optoelectronic Technology, Volume. 43, Issue 3, 233(2023)

Research on the Fabrication and Application of 230 nm Far-UVC LED Packaging Device

Wenbo LI¹, Wentao LI², Leming TANG¹, Yong YANG¹, Qiming XU^3,4, and Yanwei SHEN⁴

Author Affiliations

¹Guangdong Institute of Semiconductor Micro‑Nano Manufacturing Technology, Foshan Guangdong 528225, CHN

²State Key Laboratory of Pollution Control and Resources Reuse, School of the Environment, Nanjing University, Nanjing 1003, CHN

³Gusu Laboratory of Materials, Suzhou Jiangsu 21512, CHN

⁴Suzhou LEKIN Semiconductor Co., Ltd., Suzhou Jiangsu 21513, CHN

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Figures & Tables(6)

Fig. 1. Manufacturing process of far-UVC LED packaging device

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Fig. 2. Absorption spectra of amorphous fluorine resin and structure of fluorine resin

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Fig. 3. Optical image and cross-sectional SEM image of 230 nm far-UVC LED packaging device

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Fig. 4. Photoelectric performance of device

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Fig. 5. Light output power decay for 230 nm far-UVC LED packaging device at 100 mA

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Fig. 6. Packaging device for nitrate nitrogen testing

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Wenbo LI, Wentao LI, Leming TANG, Yong YANG, Qiming XU, Yanwei SHEN. Research on the Fabrication and Application of 230 nm Far-UVC LED Packaging Device[J]. Optoelectronic Technology, 2023, 43(3): 233

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Paper Information

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Received: Dec. 7, 2022

Accepted: --

Published Online: Mar. 21, 2024

The Author Email:

DOI:10.19453/j.cnki.1005-488x.2023.03.008

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology