Impact of Thermal Expansion Coefficient of Ultra-thin Electronic Glass on Electronic Device Performance and Strategies for Process Optimization

GONG Ruilong; FENG Zhengjun; WANG Huiyong; HAN Zhengwei; SUN Feihu; WANG Changjun

doi:10.13588/j.cnki.g.e.2096-7608.2025.02.006

Glass Enamel & Ophtalmic Optics, Volume. 53, Issue 2, 28(2025)

Impact of Thermal Expansion Coefficient of Ultra-thin Electronic Glass on Electronic Device Performance and Strategies for Process Optimization

GONG Ruilong^*, FENG Zhengjun, WANG Huiyong, HAN Zhengwei, SUN Feihu, and WANG Changjun

Author Affiliations

Heibei Panel Glass Co., Ltd., Hebei Province Company Technology Center, Hebei Province Ultra-thin Electronic Glass Technology Innovation Center, Hebei Engineering Research Center of Ultra-thin Silicate Glass, Langfang 065000, China

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GONG Ruilong, FENG Zhengjun, WANG Huiyong, HAN Zhengwei, SUN Feihu, WANG Changjun. Impact of Thermal Expansion Coefficient of Ultra-thin Electronic Glass on Electronic Device Performance and Strategies for Process Optimization[J]. Glass Enamel & Ophtalmic Optics, 2025, 53(2): 28

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Paper Information

Received: Jan. 25, 2024

Accepted: Mar. 31, 2025

Published Online: Mar. 31, 2025

The Author Email: GONG Ruilong (651854822@qq.com)

DOI:10.13588/j.cnki.g.e.2096-7608.2025.02.006

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology