Laser & Optoelectronics Progress, Volume. 58, Issue 14, 1412003(2021)

Thermal Deformation Measurement of Hollow Disk Based on Digital Image Correlation Method

Guihua Li, Wanlong Ma, Tiantian Zhu, Zhongnan Fu, and Pengxiang Ge*
Author Affiliations
  • College of Electrical Engineering and Automation, Anhui University, Hefei, Anhui 230601, China
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    Figures & Tables(9)
    Schematic diagram of the DIC method. (a) Reference image; (b) target image
    Physical image of the specimen. (a) Original image without speckle; (b) speckle pattern
    Principle of thermal deformation image acquisition and measurement system
    Outer diameters of the specimen for the reference image and the target image. (a) Reference image (180 ℃); (b) target image (20 ℃)
    Change curve of the outer diameter of the specimen during the cooling process
    Finite element meshing diagram of the specimen
    Simulation result of thermal deformation of the specimen
    • Table 1. Outer diameters of the specimen at the starting and ending temperatures

      View table

      Table 1. Outer diameters of the specimen at the starting and ending temperatures

      Measured temperature /℃Diameter in xdirection /mmDiameter in ydirection /mm
      180192.420190.558
      20191.756189.911
    • Table 2. Physical parameters of the cast aluminum

      View table

      Table 2. Physical parameters of the cast aluminum

      Temperature /℃Density /(g·cm-3)Thermal conductivity /[W·(m·K)-1]Coefficient of thermal expansionSpecific heat capacity /[J·(g·K)-1]Elastic modulus /GPaPoisson ratio
      202.81173230.9671.70.33
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    Guihua Li, Wanlong Ma, Tiantian Zhu, Zhongnan Fu, Pengxiang Ge. Thermal Deformation Measurement of Hollow Disk Based on Digital Image Correlation Method[J]. Laser & Optoelectronics Progress, 2021, 58(14): 1412003

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    Paper Information

    Category: Instrumentation, Measurement and Metrology

    Received: Sep. 12, 2020

    Accepted: Nov. 14, 2020

    Published Online: Jul. 8, 2021

    The Author Email: Pengxiang Ge (gpxiang123@163.com)

    DOI:10.3788/LOP202158.1412003

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