Laser & Infrared, Volume. 54, Issue 11, 1694(2024)

Dynamic excitation-based internal defect detection in 3D packaging

NIE Lei1, ZHANG Ming1, YU Chen-rui1, and LUO Ren-xing2
Author Affiliations
  • 1School of Mechanical Engineering, Hubei University of Technology, Wuhan 430068, China
  • 2Hubei Taihe Electric Co., Ltd., Xiangyang 441057, China
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    NIE Lei, ZHANG Ming, YU Chen-rui, LUO Ren-xing. Dynamic excitation-based internal defect detection in 3D packaging[J]. Laser & Infrared, 2024, 54(11): 1694

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    Paper Information

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    Received: Feb. 4, 2024

    Accepted: Jan. 14, 2025

    Published Online: Jan. 14, 2025

    The Author Email:

    DOI:10.3969/j.issn.1001-5078.2024.11.007

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