Dynamic Control of Ultrafast Laser Polarization for Silicon Carbide Wafer Cutting

Fig. 4. Three cutting methods to optimize polarization state and machining direction. (a) Laser polarization state is parallel to processing direction; (b) laser polarization state is perpendicular to processing direction; (c) included angle between laser polarization state and processing direction is 43°

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Fig. 5. Top and bottom surface morphologies of wafer cutting. (a1)‒(a4) When polarization state is parallel to processing direction; (b1)‒(b4) when included angle between polarization state and processing direction is 43°; (c1)‒(c4) when polarization state is perpendicular to processing direction

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Fig. 6. Influence of polarization state angle on thermal affected zones on top and bottom surfaces and cutting efficiency

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Fig. 7. Surface morphologies of wafer cutting. (a1)‒(b2) When polarization state is parallel to processing direction; (c1)‒(d2) when included angle between polarization state and processing direction is 43°; (e1)‒(f2) when polarization state is perpendicular to processing direction

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Fig. 8. Influence of polarization state angle on edge chipping sizes of top and bottom surfaces and cross-sectional roughness

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Fig. 9. EDS material elemental analysis. (a1)‒(a5) Analysis of material elements in cross section; (b1)‒(b5) analysis of material elements in top surface edge of cross section

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Table 1. Main parameters of picosecond laser
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Table 1. Main parameters of picosecond laser
Parameter Wavelength /nm Pulse duration /ps Frequency /kHz Maximum pulse energy /μJ Linear polarization degree Beam quality M² Beam mode
Content 1064 15 100‒500 1000 100∶1 <1.3 TEM₀₀

Table 2. Main parameters of liquid-crystal spatial light modulator
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Table 2. Main parameters of liquid-crystal spatial light modulator
Parameter Resolution /（pixel $\times$ pixel） Pixel pitch / $μ m$ Effective area size /（mm $\times$ mm） Fill factor /% Input signal level Frame rate /Hz Rated power /W
Value 1272 $\times$ 1024 2.5 15.9 $\times$ 12.8 96 256 60 100

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Sibo Wang, Ziqin Hong, Jinling Zhang, Junxiao Wu, Yunxia Ye, Xudong Ren. Dynamic Control of Ultrafast Laser Polarization for Silicon Carbide Wafer Cutting[J]. Laser & Optoelectronics Progress, 2024, 61(23): 2314005

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