Laser & Optoelectronics Progress, Volume. 56, Issue 2, 021603(2019)

Vacancy Formation During Solidification of Metal Ag

Haiyan Zhang1,2、* and Lichun Wang2
Author Affiliations
  • 1 Guangling College of Yangzhou University, Yangzhou, Jiangsu 225000, China
  • 2 Physical Science and Technology College, Yangzhou University, Yangzhou, Jiangsu 225002, China
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    References(37)

    [18] Kerrache A, Horbach J, Binder K. Molecular-dynamics computer simulation of crystal growth and melting in Al50Ni50[J]. Europhysics Letters, 81, 58001(2008).

    [19] Qi C, Li J F, Xu B et al. Atomistic characterization of solid-liquid interfaces in the Cu-Ni binary alloy system[J]. Computational Materials Science, 125, 72-81(2016).

    [24] Frenkel J. Kinetic theory of liquids[M]. New York: Dover Publications(1955).

    [34] Mendelev M I, Rahman M J, Hoyt J J et al. Molecular-dynamics study of solid-liquid interface migration in FCC metals[J]. Modelling and Simulation in Materials Science and Engineering, 18, 074002(2010).

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    Haiyan Zhang, Lichun Wang. Vacancy Formation During Solidification of Metal Ag[J]. Laser & Optoelectronics Progress, 2019, 56(2): 021603

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    Paper Information

    Category: Materials

    Received: Jul. 24, 2018

    Accepted: Aug. 2, 2018

    Published Online: Aug. 1, 2019

    The Author Email: Haiyan Zhang (zhanghy@yzu.edu.cn)

    DOI:10.3788/LOP56.021603

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