Acta Optica Sinica, Volume. 42, Issue 1, 0112003(2022)
Envelope Element Local Digital Image Correlation Method for Crack Tip Deformation Field Measurement
Fig. 2. Calculation for three types of methods. (a) Mesh without crack; (b) mesh of crack face; (c) mesh of crack tip
Fig. 3. Schematic diagrams of three kinds of smoothing calculation points. (a) Points far from crack; (b) points near crack face; (c) points near crack tip
Fig. 5. RMSE of displacement field U and strain field Ux versus element/subset size. (a) Displacement field U; (b) strain field Ux
Fig. 6. Comparison between theoretical solution curve and optimum solution curves of strain Ux obtained by different methods on lines. (a) Line 1; (b) line 2
Fig. 7. Relationship between RMSE of strain field Ux and Gaussian noise level for three methods
Fig. 8. Reference image and deformed image. (a) Reference image; (b) deformed image
Fig. 10. Displacement field U and strain field Ux calculated by HELDIC method. (a) Displacement field U; (b) strain field Ux
Fig. 11. Comparison of strain field Ux at lines 1 and 2 obtained by three different methods
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Jianxin Du, Jiaqing Zhao, Haitao Wang, Libin Sun, Xinxin Wu. Envelope Element Local Digital Image Correlation Method for Crack Tip Deformation Field Measurement[J]. Acta Optica Sinica, 2022, 42(1): 0112003
Category: Instrumentation, Measurement and Metrology
Received: May. 27, 2021
Accepted: Jul. 13, 2021
Published Online: Dec. 22, 2021
The Author Email: Jiaqing Zhao (jqzhao@mail.tsinghua.edn.cn)