Acta Optica Sinica, Volume. 42, Issue 1, 0112003(2022)

Envelope Element Local Digital Image Correlation Method for Crack Tip Deformation Field Measurement

Jianxin Du, Jiaqing Zhao*, Haitao Wang, Libin Sun, and Xinxin Wu
Author Affiliations
  • Institute of Nuclear and New Energy Technology, Collaborative Innovation Center of Advanced Nuclear Energy Technology, Key Laboratory of Advanced Reactor Engineering and Safety of Ministry of Education, Tsinghua University, Beijing 100084, China
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    Figures & Tables(12)
    Mesh division in ROI
    Calculation for three types of methods. (a) Mesh without crack; (b) mesh of crack face; (c) mesh of crack tip
    Schematic diagrams of three kinds of smoothing calculation points. (a) Points far from crack; (b) points near crack face; (c) points near crack tip
    Simulated images with crack. (a) Reference image; (b) deformed image
    RMSE of displacement field U and strain field Ux versus element/subset size. (a) Displacement field U; (b) strain field Ux
    Comparison between theoretical solution curve and optimum solution curves of strain Ux obtained by different methods on lines. (a) Line 1; (b) line 2
    Relationship between RMSE of strain field Ux and Gaussian noise level for three methods
    Reference image and deformed image. (a) Reference image; (b) deformed image
    Track tips under an optical microscope. (a) 100×; (b) 200×
    Displacement field U and strain field Ux calculated by HELDIC method. (a) Displacement field U; (b) strain field Ux
    Comparison of strain field Ux at lines 1 and 2 obtained by three different methods
    • Table 1. Element/subset sizes used in three methods

      View table

      Table 1. Element/subset sizes used in three methods

      Element/subset No.12345
      Subset size of 1-local /pixel1115212531
      Subset size of 2-local /pixel1115212531
      Element size of HELDIC /pixel60708090100
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    Jianxin Du, Jiaqing Zhao, Haitao Wang, Libin Sun, Xinxin Wu. Envelope Element Local Digital Image Correlation Method for Crack Tip Deformation Field Measurement[J]. Acta Optica Sinica, 2022, 42(1): 0112003

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    Paper Information

    Category: Instrumentation, Measurement and Metrology

    Received: May. 27, 2021

    Accepted: Jul. 13, 2021

    Published Online: Dec. 22, 2021

    The Author Email: Jiaqing Zhao (jqzhao@mail.tsinghua.edn.cn)

    DOI:10.3788/AOS202242.0112003

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