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Piezoelectrics & Acoustooptics, Volume. 46, Issue 3, 339(2024)

Research on Au-Sn Bonding for Wafer-Level Packaging of FBAR Filters

JIN Zhong1, ZHANG Jiqin2, LYU Junhao1, RUAN Wenbiao2, LIU Ya1, ZENG Jingyi1, SUN Mingbao1, and SUN Yanhong1
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    [3] [3] LU Dandan, MI Jia, PENG Xingwen,et al.Study on wafer bonding technology of SAW devices［J］.Piezoelectrics and Acoustooptics, 2020,42(3):361-364.

    [8] [8] TANG Daihua, JIN Zhong, SI Meiju,et al.Study on cavity collapse resisting molding pressure in WLP of SAW filter［J］.Piezoelectrics and Acoustooptics, 2021,43(1):84-87.

    [10] [10] LIU Ya, SUN Ke, MA Jinyi, et al.Development of C band WLP packaged FBAR［J］.Piezoelectrics and Acoustooptics, 2021,44(2):260-263.

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    JIN Zhong, ZHANG Jiqin, LYU Junhao, RUAN Wenbiao, LIU Ya, ZENG Jingyi, SUN Mingbao, SUN Yanhong. Research on Au-Sn Bonding for Wafer-Level Packaging of FBAR Filters[J]. Piezoelectrics & Acoustooptics, 2024, 46(3): 339

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    Paper Information

    Received: Jan. 12, 2023

    Accepted: --

    Published Online: Aug. 29, 2024

    The Author Email:

    DOI:10.11977/j.issn.1004-2474.2024.03.011

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology