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Piezoelectrics & Acoustooptics, Volume. 47, Issue 1, 40(2025)

Design of a Low-Loss Millimeter-Wave Front-End Module with Ball Grid Array Packaging

PU Xingming1... ZHAO Yi2, DONG Gang1, HAN Shihong2, FAN Qisheng2 and YU Huaiqiang2 |Show fewer author(s)
Author Affiliations
  • 1Faculty of Integrated Circuit, Xidian University, Xi’an 710071, China
  • 2The 26th Research Institute of China Electronics Technology Group Corporation, Chongqing 400060, China
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    [5] [5] ZHONG Y, XU L, YANG J. Co-simulation design of RF front-end based on three-dimensional vertical interconnection of BGA[C]∥Dalian, China: 2023 International Conference on Advances in Electrical Engineering and Computer Applications, 2023: 547-552.

    [6] [6] ZHU W T, ZHANG H B, KUANG X L. Study on rework process of BGA components[C]∥Changsha, China: Proceedings of 2015 International Conference on Electronic Packaging Technology(ICEPT), 2015: 682-68.

    [7] [7] LIU H, LI C, HAO J, et al. An ultra-wideband vertical interconnection structure[C]∥Harbin, China: 2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT), 2022: 1-3.

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    PU Xingming, ZHAO Yi, DONG Gang, HAN Shihong, FAN Qisheng, YU Huaiqiang. Design of a Low-Loss Millimeter-Wave Front-End Module with Ball Grid Array Packaging[J]. Piezoelectrics & Acoustooptics, 2025, 47(1): 40

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    Paper Information

    Received: Jan. 9, 2025

    Accepted: Apr. 17, 2025

    Published Online: Apr. 17, 2025

    The Author Email:

    DOI:10.11977/j.issn.1004-2474.2025.01.006

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology