Laser & Optoelectronics Progress, Volume. 56, Issue 15, 150603(2019)

Preparation of Fiber-Optic Interferometer Based Infrasound Sensor

Hanzheng Li1,2, Gaomi Wu1,2, Zhenjun Ma1,2, Dipeng Ren1,2, Mengying Zhang1, Ran Gao1, and Zhimei Qi1,2、*
Author Affiliations
  • 1 State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China
  • 2 University of Chinese Academy of Sciences, Beijing 100049, China
  • show less
    Figures & Tables(12)
    Structure of diaphragm EFPI sensor
    Relationship between output signal and low-frequency infrasound disturbance
    Result of first-order modal analysis by ANSYS
    Relationship between different model parameters and first-order resonant frequency. (a) Diaphragm material; (b) diaphragm thickness; (c) diaphragm radius; (d) diaphragm prestress
    Results of finite element harmonic response analysis by ANSYS (0-10 kHz)
    EFPI sensor. (a) Structural diagram; (b) photograph
    Interference spectrum of EFPI sensor
    Test device of optical fiber EFPI acoustic sensor
    Characterization of sensor characteristics. (a) Frequency response; (b) Sensitivity
    Signal output of sensor under 5 Hz sound source excitation. (a) Time domain; (b) frequency domain
    Signal output of sensor under 1 Hz sound source excitation. (a) Time domain; (b) frequency domain
    Signal output of sensor under 0.5 Hz sound source excitation. (a) Time domain; (b) frequency domain
    Tools

    Get Citation

    Copy Citation Text

    Hanzheng Li, Gaomi Wu, Zhenjun Ma, Dipeng Ren, Mengying Zhang, Ran Gao, Zhimei Qi. Preparation of Fiber-Optic Interferometer Based Infrasound Sensor[J]. Laser & Optoelectronics Progress, 2019, 56(15): 150603

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Fiber Optics and Optical Communications

    Received: Jan. 28, 2019

    Accepted: Mar. 11, 2019

    Published Online: Aug. 5, 2019

    The Author Email: Zhimei Qi (zhimei-qi@mail.ie.ac.cn)

    DOI:10.3788/LOP56.150603

    Topics