Laser & Optoelectronics Progress, Volume. 59, Issue 17, 1714007(2022)

Removal of Liquid Crystal Polymer Flexible Copper-Clad Laminates Using Ultraviolet Laser

Li Cheng, Chao Wu*, Yan Chen, and Zhengjun Xiong
Author Affiliations
  • Institute of Laser and Intelligent Manufacturing Technology, South-Central Minzu University, Wuhan 430074, Hubei , China
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    Figures & Tables(16)
    Experimental material. (a) Micromorphology of LCP flexible copper-clad laminates; (b) size of LCP flexible copper-clad laminates; (c) molecular structure of PHB-PPI copolymer LCP
    Schematic of the experimental setup of ultraviolet processing system
    Experimental results. (a) Schematic of heat-affected zone; (b) HAZ measurement chart of LCP under a confocal microscope
    Removal depth versus average power
    HAZ width versus average power
    Experimental results. (a) Energy density distribution of a Gaussian beam; (b) effect of laser power on plasma zone
    Micromorphology of LCP substrate film removal obtained under different laser powers. (a) P=1.5 W; (b) P=2.7 W; (c) P=3.6 W
    Removal depth versus scanning speed
    HAZ width versus scanning speed
    Effect of spot overlap rate on film removal. (a) v v>700 mm/s
    Micromorphology of the LCP substrate film removal obtained at different scanning speeds. (a) v =300 mm/s; (b) v =600 mm/s; (c) v =1000 mm/s
    Removal depth versus number of scanning layers
    HAZ width versus number of scanning layers
    Micromorphology of the LCP substrate film removal obtained with different number of layers. (a) Number of layers is 1; (b) number of layers is 4; (c) number of layers is 8
    • Table 1. Physicochemical properties of experimental sample

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      Table 1. Physicochemical properties of experimental sample

      Test methodTechnical parameterValue
      Differential scanning calorimetryMelting point /°C330-350
      UL 94ZUFlammabilityVTM-0
      Legion method (50% relative humidity)Moistrue absorption /%0.03
      IEC62631-3-1/2Surface resistivity /Ω>5×1016
      IEC62631-3-1/2Volume resistivity /(Ω·cm)>2×1016
      Fabry-Perot methodDielectric dissipation factor0.002-0.003
      Thermomechanical analysisCoefficient thermal expansion /(10-6·°C-116
    • Table 2. Main technical parameters of laser

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      Table 2. Main technical parameters of laser

      Technical parameterValue
      Wavelength /nm355
      Average power /W0-45
      Pulse energy /µJ0-62
      Pulse width /ns5
      Repetition frequency /kHz0-1000
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    Li Cheng, Chao Wu, Yan Chen, Zhengjun Xiong. Removal of Liquid Crystal Polymer Flexible Copper-Clad Laminates Using Ultraviolet Laser[J]. Laser & Optoelectronics Progress, 2022, 59(17): 1714007

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    Paper Information

    Category: Lasers and Laser Optics

    Received: Jul. 28, 2021

    Accepted: Sep. 1, 2021

    Published Online: Aug. 22, 2022

    The Author Email: Chao Wu (wind0101880@126.com)

    DOI:10.3788/LOP202259.1714007

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