Microelectronics, Volume. 52, Issue 4, 635(2022)
Research on Packaging of Thermoelectric MEMS Microwave Power Sensors
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TANG Meng, YU Wenting, ZHU Yucheng, SUN Lilu, HUA Rui, WANG Debo. Research on Packaging of Thermoelectric MEMS Microwave Power Sensors[J]. Microelectronics, 2022, 52(4): 635
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Received: Nov. 30, 2021
Accepted: --
Published Online: Jan. 18, 2023
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