Chip Crack Imaging Detection Based on Line Laser Phase-Locked Thermal Imaging

Ying Xu; Qingyuan Wang; Congcong Luo; Sohn Hoon

doi:10.3788/LOP57.061018

Laser & Optoelectronics Progress, Volume. 57, Issue 6, 061018(2020)

Chip Crack Imaging Detection Based on Line Laser Phase-Locked Thermal Imaging

Ying Xu^1、*, Qingyuan Wang¹, Congcong Luo¹, and Sohn Hoon²

¹College of Civil and Environmental Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen Key Lab of Urban & Civil Engineering Disaster Prevention & Reduction, Shenzhen, Guangdong 518055, China;

²Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34708, Republic of Korea

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Ying Xu, Qingyuan Wang, Congcong Luo, Sohn Hoon. Chip Crack Imaging Detection Based on Line Laser Phase-Locked Thermal Imaging[J]. Laser & Optoelectronics Progress, 2020, 57(6): 061018

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Paper Information

Category: Image Processing

Received: Jul. 29, 2019

Accepted: Sep. 24, 2019

Published Online: Mar. 6, 2020

The Author Email: Ying Xu (cexyx@hotmail.com)

DOI:10.3788/LOP57.061018

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology