Photonics Research, Volume. 12, Issue 5, 1055(2024)

Highly efficient fiber to Si waveguide free-form coupler for foundry-scale silicon photonics Editors' Pick

Luigi Ranno1... Jia Xu Brian Sia1,2, Cosmin Popescu1, Drew Weninger1, Samuel Serna1,3, Shaoliang Yu4, Lionel C. Kimerling1, Anuradha Agarwal5, Tian Gu1,5, and Juejun Hu15,* |Show fewer author(s)
Author Affiliations
  • 1Department of Materials Science & Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA
  • 2Centre for Micro- & Nano-Electronics (CMNE), Nanyang Technological University, Singapore 639798, Singapore
  • 3Department of Physics, Photonics and Optical Engineering, Bridgewater State University, Bridgewater, Massachusetts 02324, USA
  • 4Zhejiang Laboratory, Hangzhou 311100, China
  • 5Materials Research Laboratory, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA
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    References(70)

    [8] K. Jang, A. Novick, A. Rizzo. Universal CMOS-foundry compatible platform for ultra-low loss SOI waveguide bends. Optical Fiber Communications Conference and Exhibition (OFC), Th3A.5(2023).

    [21] R. Polster, L. Y. Dai, O. A. Jimenez. Wafer-scale high-density edge coupling for high throughput testing of silicon photonics. Optical Fiber Communications Conference and Exposition (OFC), 1-3(2018).

    [24] R. S. Tummidi, M. Webster. Multilayer silicon nitride-based coupler integrated into a silicon photonics platform with <1 dB coupling loss to a standard SMF over O, S, C and L optical bands. Optical Fiber Communications Conference and Exhibition (OFC), Th2A.10(2020).

    [33] S. Yu, T. K. Gaylord, M. S. Bakir. Scalable fiber-array-to-chip interconnections with sub-micron alignment accuracy. IEEE 73rd Electronic Components and Technology Conference (ECTC), 748-752(2023).

    [41] N. Lindenmann. Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces(2018).

    [53] B. Snyder, P. O’Brien. Planar fiber packaging method for silicon photonic integrated circuits. Optical Fiber Communications Conference and Exposition (OFC), OM2E.5(2012).

    [61] P. Gruber. Method for the lithography-based additive manufacturing of a three-dimensional component. U.S. patent(2023).

    [63] L. Ranno, T. Gu, J. Hu. Integrated freeform optical couplers and fabrication methods thereof. U.S. patent(2023).

    [64] F. Cantoni, D. Maher, E. Bosler. Round-robin testing of commercial two-photon polymerization 3D printers. Addit. Manuf., 76, 103761(2023).

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    Luigi Ranno, Jia Xu Brian Sia, Cosmin Popescu, Drew Weninger, Samuel Serna, Shaoliang Yu, Lionel C. Kimerling, Anuradha Agarwal, Tian Gu, Juejun Hu, "Highly efficient fiber to Si waveguide free-form coupler for foundry-scale silicon photonics," Photonics Res. 12, 1055 (2024)

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    Paper Information

    Category: Integrated Optics

    Received: Dec. 13, 2023

    Accepted: Mar. 17, 2024

    Published Online: May. 6, 2024

    The Author Email: Juejun Hu (hujuejun@mit.edu)

    DOI:10.1364/PRJ.514999

    CSTR:32188.14.PRJ.514999

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