Fig. 1. Fabrication scheme of flexible displays by means of excimer LLO^[15]

Fig. 2. SEM images of microstructures of PI-glass interface induced by different laser energy densities^[16]. (a) Before irradiation; (b) 80 mJ·cm^-2; (c) 87 mJ·cm^-2; (d) 93 mJ·cm^-2

Fig. 3. Schematic of separation process for PZT thin film using LLO method^[25]

Fig. 4. Schematic illustrations of process for fabricating RRAM on flexible substrate via LLO method^[32]

Fig. 5. FoWLP chip package process^[34]

Fig. 6. Schematic illustration of selective laser lift-off^[35]

Fig. 7. Principle of tmSLADT technique^[38]

Fig. 8. Si microchips transferred by tmSLADT technique^[39]

Fig. 9. Schematic of ultrafast laser-treated thin film^[45]

Fig. 10. TEM images of cross sections of thin films processed by LLO. (a) Picosecond laser; (b) femtosecond laser^[45]