Chinese Journal of Lasers, Volume. 47, Issue 1, 0100001(2020)

Application of Laser Lift-off Technique in Flexible Electronics Manufacturing

Lingfei Ji1...2,*, Rui Ma1,2, Ximin Zhang1,2, Zhengyang Sun1,2, and Xin Li12 |Show fewer author(s)
Author Affiliations
  • 1Institute of Laser Engineering, Beijing University of Technology, Beijing 100124, China
  • 2Key Laboratory of Trans-Scale Laser Manufacturing Technology, Ministry of Education, Beijing 100124, China
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    Laser lift-off (LLO) is a technique used to transfer devices to terminal substrates through the ablation of materials by pulsed laser irradiation. Recently, LLO has become the major technique for the fabrication of flexible electronic devices because of its wide material applicability and process compatibility. Further, the representative research achievements of LLO in case of the fabrication of flexible electronics are investigated and presented in this study with respect to the basic mechanisms and technological features, and novel theories and application techniques are given particular emphasis. Accordingly, the application prospects of the LLO technique, especially the possibility of ultrafast laser applications, are summarized and forecasted.

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    Lingfei Ji, Rui Ma, Ximin Zhang, Zhengyang Sun, Xin Li. Application of Laser Lift-off Technique in Flexible Electronics Manufacturing[J]. Chinese Journal of Lasers, 2020, 47(1): 0100001

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    Paper Information

    Category: reviews

    Received: Jul. 22, 2019

    Accepted: Sep. 3, 2019

    Published Online: Jan. 9, 2020

    The Author Email: Ji Lingfei (ncltji@bjut.edu.cn)

    DOI:10.3788/CJL202047.0100001

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