Optics and Precision Engineering, Volume. 20, Issue 2, 321(2012)

Effect of assistant solvent on in-mold bonding of PMMA microfluidic chips

XU Zheng, WANG Ji-zhang*, YANG Duo, LIU Chong, and WANG Li-ding
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    References(21)

    [1] [1] LIN B CH, QIN J H. Graphic Laboratory on a Microfluidic Chip[M]. Beijing: Science Press,2008.(in Chinese)

    [2] [2] SUN Y, KWOK Y C, NGUYEN N T. Low-pressure, high-temperature thermal bonding of polymeric microfluidic devices and their applications for electrophoretic separation[J]. J. Micromech. Microeng, 2006(16): 1681-1688.

    [3] [3] ZHANG Z B, WANG X D, LUO Y, et al.. Thermal assisted ultrasonic bonding method for poly(methyl methacrylate) (PMMA) microfluidic devices[J]. Talanta, 2010,81(4-5): 1331-1338.

    [5] [5] NG S H, THEODORE R, WANG Z F. Formation of embedded microchannels by a solvent displacement bonding technique[C]. Proceedings of 9th Electronics Packaging Technology Conference, India: IEEE,2007: 211-214.

    [6] [6] NIRANJAN P, ALBERTO C B, MARCO S. Solvent effects on the thermal and mechanical properties of poly(methyl methacrylate) casted from concentrated solutions[J]. Advances in Polymer Technology, 2011,12(20): 12-20.

    [7] [7] LAI J J, CHEN X Q, ZHOU H, et al.. Laser locally heating and bonding for micro system packaging[J]. Micronanoelectronic Technology, 2003,(7/8): 257-260. (in Chinese)

    [8] [8] USSING T, PETERSEN L V, NIELSEN C B, et al.. Micro laser welding of polymer microstructures using low power laser diodes[J]. Int J. Adv. Manuf. Technol., 2007,33(1-2): 198-205.

    [9] [9] SUZUKI Y, YAMADA M,SEKI M. Sol-gel based fabrication of hybrid microfluidic devices composed of PDMS and thermoplastic substrates[J]. Sensors and Actuators B, 2010,148(1): 323-329.

    [10] [10] UMBRECHT F,MLLER D, GATTIKER F, et al.. Solvent assisted bonding of polymethylmethacrylate: characterization using the response surface methodology[J]. Sensors and Actuators B, 2009,156(1): 121-128.

    [11] [11] LIN C H,CHAO C H,LAN CH W. Low azeotropic solvent for bonding of PMMA microfluidic devices[J]. Sensors and Actuators B, 2007,121(2): 698-705.

    [12] [12] SHAH J J, GEIST J, LOCASCIO L E, et al.. Capillarity induced solvent-actuated bonding of polymeric microfluidic devices[J]. Anal. Chem., 2006,78(10): 3348-3353.

    [13] [13] JIANG B Y, LIU Y, LI D B, et al.. Research on efficient bonding procedure of PMMA microfluidic chip[J]. China Plastics Industry, 2010,38(4): 33-36. (in Chinese)

    [14] [14] LAN C H, JIANG B Y, LIU Y, et al.. Simulation study of microchannel distortion of polymeric microfluidic chip with bonding technique[J]. China Plastics Industry, 2009,37(5): 31-34. (in Chinese)

    [15] [15] YAN ZH Y, SHI H Q, LIANG SH Q, et al.. Progress of study on the interfacial adhesion of polymer composites[J]. Journal of Zhongkai University of Agriculture and Technology, 2007,20(2): 62-65. (in Chinese)

    [16] [16] ZHOU R M. Diffusion theory of adhesion mechanism and the solubility parameters[J]. Journal of Wenzhou Teachers College, 1994,(3): 60-64. (in Chinese)

    [17] [17] GAO B J. Application for solubility parameters[J]. Shanxi Chemical Industry, 1998,(2): 18-19. (in Chinese)

    [18] [18] MAIR D A, ROLANDI M, SNAUKO M, et al.. Room-temperature bonding for plastic high-pressure microfluidic chips[J]. Anal. Chem, 2007,79(13): 5097-5102.

    [19] [19] SHAH J J, GEIST J, LOCASCIO L E, et al.. Capillarity induced solvent-actuated bonding of polymeric microfluidic devices[J]. Anal. Chem, 2006,78(10): 3348-3353.

    [20] [20] SUN X H, PEENI B A, YANG W C, et al.. Rapid prototyping of poly(methyl methacrylate) microfluidic systems using solvent imprinting and bonding[J]. Journal of Chromatography A, 2007,1162: 162-166.

    [21] [21] LI L P, DU X G. Solvent bonding method of polycarbonate microfluidic chips[J]. Chinese Journal of Analytical Chemistry, 2009,37: 138. (in Chinese)

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    XU Zheng, WANG Ji-zhang, YANG Duo, LIU Chong, WANG Li-ding. Effect of assistant solvent on in-mold bonding of PMMA microfluidic chips[J]. Optics and Precision Engineering, 2012, 20(2): 321

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    Paper Information

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    Received: Jun. 27, 2011

    Accepted: --

    Published Online: Mar. 6, 2012

    The Author Email: WANG Ji-zhang (jizhang_wang@163.com)

    DOI:10.3788/ope.20122002.0321

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