INFRARED, Volume. 44, Issue 10, 1(2023)

Thermal Stress Model and Structural Optimization of Large Area Array Mercury Cadmium Telluride Chips

Han WANG1, Qing WU2, Chao WANG1, Ze-lin AN1, and Ru-zhi WANG1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    References(13)

    [1] [1] Liu M, Wang C, Zhou Q L. Development of Small Pixel HgCdTe Infrared Detectors \[J\]. Chinese Physics B, 2019, 28(3): 17-25.

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    [4] [4] Shaveisi M, Aliparast P. Dark Current Evaluation in HgCdTe-based nBn Infrared Detectors \[C\]. Tehran: 2021 Iranian International Conference on Microelectronics (IICM), 2021.

    [5] [5] Cui S N, Chen W Q, Jiang D W, et al. Dark Current Simulation and Analysis for InAs/GaSb Long Wavelength Infrared Barrier Detectors \[J\]. Infrared Physics & Technology, 2022, 121: 104006.

    [6] [6] Zhang L, Li Y, Zhang J, et al. Numerical Analysis of Temperature and Stress Fields in Hybrid Indium Antimonide Arrays Detector with Laser Irradiation \[J\]. Optical and Quantum Electronics, 2019, 51(8): 262.

    [7] [7] Pinkie B, Bellotti E. Large-scale Numerical Simulation of Reduced-pitch HgCdTe Infrared Detector Arrays \[C\]. SPIE, 2013, 8704: 823-831.

    [8] [8] Lou S L, Han Y L, Ren J C, et al. Research on Noise Simulation of Infrared Detector \[J\]. Advanced Materials Research, 2012, 433: 4120-4123.

    [11] [11] Meng Q D, Lv Y Q, Lu Z X, et al. Stress in HgCdTe Large Infrared Focal Plane Array Detector Analyzed with Finite Element Analysis \[J\]. Journal of Infrared and Millimeter Wave, 2010, 29(6): 431-434.

    [12] [12] Sham M L, Kim J K, Park J H. Thermal Performance of Flip Chip Packages: Numerical Study of Thermo-Mechanical Interactions \[J\]. Computational Materials Science, 2008, 43(3): 469-480.

    [15] [15] Zhang C P, Lian Y F, Yu X F, et al. Numerical and Experimental Studies on Laminar Hydrodynamic and Thermal Characteristics in Fractal-like Microchannel Networks. Part A: Comparisons of Two Numerical Analysis Methods on Friction Factor and Nusselt Number \[J\]. International Journal of Heat & Mass Transfer, 2013, 66(11): 930-938.

    [18] [18] Duperrex L, Pesci R, Le Boterf P, et al. Simulation and Measurement of Residual Stress and Warpage in a HgCdTe-based Infrared Detector at 100 K \[J\]. Materials Science and Engineering: A, 2021, 813: 141148.

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    WANG Han, WU Qing, WANG Chao, AN Ze-lin, WANG Ru-zhi. Thermal Stress Model and Structural Optimization of Large Area Array Mercury Cadmium Telluride Chips[J]. INFRARED, 2023, 44(10): 1

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    Paper Information

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    Received: Apr. 3, 2023

    Accepted: --

    Published Online: Jan. 16, 2024

    The Author Email:

    DOI:10.3969/j.issn.1672-8785.2023.10.001

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