Chinese Journal of Lasers, Volume. 48, Issue 8, 0802012(2021)

Direct Laser Writing of Micro/Nano Copper Structures and Their Applications

Xingwen Zhou, Jianing Liao, Yu Yao, Hui Kang, Wei Guo, and Peng Peng*
Author Affiliations
  • School of Mechanical Engineering & Automation, Beihang University, Beijing 100191, China
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    Figures & Tables(7)
    Typical “bottom-up” laser processing of micro/nano structures. (a) Laser-induced assembly[21]; (b) comparison of laser sintering and bulk heating[27]; (c) laser-induced hydrothermal growth[28]
    Typical manufacturing process of the direct laser writing based on the copper ionic precursor
    Effect of laser parameters on the written copper structure[48]. (a) Width of structure; (b) composition;(c) microstructure
    Comparison of resistivity and microstructure of the laser written copper structures based on different precursors
    Direct laser writing of Cu-based composite micro-nano structure. (a) Schematic diagram of the formation mechanism of the Cu-C composite structure[45]; (b) microstructure and elements distribution of the typical Cu-C composite structure; (c) comparison of oxidation resistance of Cu and Cu-C structures[47]; (d) structure of the directly written Cu oxides at a low laser power[48]
    Typical applications of the conductive Cu structures. (a) Flexible electrode[47]; (b) monitoring the finger movement using the strain sensor[44]; (c) response of the proximity/touch sensor to finger touch[71]; (d) planar antenna and its bandwidth[45]
    Typical applications of the laser written functional Cu-based structures. (a) Flexible heater[47]; (b) quasi-solid capacitor and its cyclic voltammogram[46]; (c) monitoring the breath rate using the strain sensor[48]; (d) temperature sensor and its temperature response curves[84]
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    Xingwen Zhou, Jianing Liao, Yu Yao, Hui Kang, Wei Guo, Peng Peng. Direct Laser Writing of Micro/Nano Copper Structures and Their Applications[J]. Chinese Journal of Lasers, 2021, 48(8): 0802012

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    Paper Information

    Category: laser manufacturing

    Received: Nov. 23, 2020

    Accepted: Feb. 23, 2021

    Published Online: Apr. 15, 2021

    The Author Email: Peng Peng (ppeng@buaa.edu.cn)

    DOI:10.3788/CJL202148.0802012

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