Chinese Journal of Lasers, Volume. 33, Issue suppl, 395(2006)

Application of Electronic Speckle Pattern Interferometry in Heat Reliability Research on Very Large Scale Integration Package

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    [in Chinese], [in Chinese], [in Chinese]. Application of Electronic Speckle Pattern Interferometry in Heat Reliability Research on Very Large Scale Integration Package[J]. Chinese Journal of Lasers, 2006, 33(suppl): 395

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    Paper Information

    Category: Measurement and metrology

    Received: --

    Accepted: --

    Published Online: Apr. 21, 2006

    The Author Email: (xmxiong@gliet.edu.cn)

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