Acta Optica Sinica, Volume. 44, Issue 15, 1513004(2024)

Advances and Challenges in Polymer Three-Dimensional Photonic Integrated Circuits (Invited)

Yuexin Yin and Daming Zhang*
Author Affiliations
  • State Key Laboratory of Integrated Optoelectronics, College of Electronic Science & Engineering, Jilin University, Changchun 130012, Jilin, China
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    References(104)

    [13] Bian Y S, Ramachandran K, Wu Z J et al. 3D integrated laser attach technology on a 300-mm monolithic CMOS silicon photonics platform[J]. IEEE Journal of Selected Topics in Quantum Electronics, 29, 8200519(2023).

    [71] Wang Y X, Liao C R, Zou M Q et al. Advances in MEMS sensors based on two-photon polymerization 3D printing (invited)[J]. Chinese Journal of Lasers, 51, 1202409(2024).

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    Yuexin Yin, Daming Zhang. Advances and Challenges in Polymer Three-Dimensional Photonic Integrated Circuits (Invited)[J]. Acta Optica Sinica, 2024, 44(15): 1513004

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    Paper Information

    Category: Integrated Optics

    Received: Apr. 24, 2024

    Accepted: Jul. 15, 2024

    Published Online: Jul. 31, 2024

    The Author Email: Zhang Daming (zhangdm@jlu.edu.cn)

    DOI:10.3788/AOS240905

    CSTR:32393.14.AOS240905

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