[2] [2] Kim L，Hwang W J，Shin M W. Thermal Resistance Analysis of High Power LEDs with Multi-chip Package [C]// Proceedings of the IEEE 56th Electronic Components and Technology Conference，San Diego，Calif，USA，May 30 - June 2，2006： 1076-1081.

[6] [6] WANG Hong，CHEN Li，YE Feifei，et al. The optical design and simulation of multi-chip LED array package structure [J]. Proceedings of SPIE (S0277-786X)，2010，7849(33)：1-9.

[7] [7] Borbély ákos，Johnson S. Performance of phosphor-coated light-emitting diode optics in ray-trace simulations [J]. Optical Engineerring(S0091-3286)，2005，44(11)：111308.1-111308.4.

[8] [8] Trcepro User’s Manual Release3.0. Lambda Research Corporation，2002.

[10] [10] ZHANG Jianbao，WU Zhihao，LI Yang，et al. Improved Performance of GaN-Based Light-Emitting Diodes via AlInGaN/InGaN Electron-Emitting Layer [J]. Applied Physics Express(S1882-0778)，2012，5(11)：112101.1-112101.3.