Infrared Technology, Volume. 44, Issue 9, 979(2022)

Thermal Image Data Processing Technology of Pseudo Soldering Based on Trend Analyzing

Lixia XU*, Lixia LIU, Yaodong YANG, Shuangfeng ZHOU, Haiquan ZHAO, and Jing GAO
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    References(2)

    [7] [7] ZHAO Xiangxi, ZHANG Wei, KONG Lingchao. Multi points temperature measurement of infrared scanning method on surface mount technology[C]//18th International Conference on Electronic Packaging Technology (ICEPT), 2017: 182-186.

    [8] [8] LIU Junyan, TANG Qingju, WANG Yang. The study of inspection on SiC coated carbon–carbon composite with subsurface defects by lock-in thermography[J]. Composites Science and Technology, 2012, 72: 1240-1250.

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    XU Lixia, LIU Lixia, YANG Yaodong, ZHOU Shuangfeng, ZHAO Haiquan, GAO Jing. Thermal Image Data Processing Technology of Pseudo Soldering Based on Trend Analyzing[J]. Infrared Technology, 2022, 44(9): 979

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    Paper Information

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    Received: Dec. 16, 2020

    Accepted: --

    Published Online: Oct. 29, 2022

    The Author Email: Lixia XU (xulixiabuaa@163.com)

    DOI:

    CSTR:32186.14.

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