Fig. 1. (a) Setup of an FCCVD system equipped with the water-cooling component. (b) A photo of the water-cooling component. (c) Target frame used to fix the target holder or the Si wafer in the deposition zone.

Fig. 2. (a) An as-prepared testing CNF target. (b) Part of the testing CNF target having been wiped off. (c) The testing target where the Cu powder has been sprinkled on the upper surface. (d) Schematic diagram of the thickness measurement method of CNFs. Image of the morphology of the surface of (e) the Si wafer and (f) the CNF under confocal microscopy. (g) SEM image of a Cu particle on the surface of CNF. (h) SEM image of the cross section of a CNF with thickness of 152 ; the red dashed lines indicate the boundaries of CNF. (i) Comparison between measurements from SEM (yellow bars) and confocal microscope (green bars).

Fig. 3. (a) Sublimation rate of catalyst as a function of the temperature of the sublimation zone. (b) Thickness of CNFs as a function of the deposition time.

Fig. 4. (a) Thickness of CNF measured along the x direction (green dots) and y direction (red dots). (b) SEM image of a CNF target. The red circle with diameter of 4 m represents a laser focal spot. (c) An enlarged view showing the detailed morphology of the CNTs. (d) Without the water-cooling component, plastic targets were broken during the deposition. Double-layer targets composed of CNFs and ultrathin (e) plastic and (f) metal foil, using the improved synthesis method.