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Chinese Journal of Liquid Crystals and Displays, Volume. 37, Issue 3, 342(2022)

Research of via hole resistance and current withstanding properties in TFT array substrate

CHEN Yun-jin*, OU Zhong-xing, FENG Yu-chun, LIN Chen, LIU Yao, ZHANG Qian, CHEN Xi, ZHOU He, and LIU Wen-rui
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    [8] [8] OSONO S, UCHIYAMA Y, KITAZOE M, et al. Coverage properties of silicon nitride film prepared by the Cat-CVD method [J]. Thin Solid Films, 2003, 430(1/2): 165-169.

    [9] [9] HEYA A, MINAMIKAWA T, NIKI T, et al. Coverage properties of SiNx films prepared by catalytic chemical vapor deposition on trenched substrates below 80 ℃ [J]. Thin Solid Films, 2008, 516(10): 3000-3004.

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    CHEN Yun-jin, OU Zhong-xing, FENG Yu-chun, LIN Chen, LIU Yao, ZHANG Qian, CHEN Xi, ZHOU He, LIU Wen-rui. Research of via hole resistance and current withstanding properties in TFT array substrate[J]. Chinese Journal of Liquid Crystals and Displays, 2022, 37(3): 342

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    Received: Sep. 23, 2021

    Accepted: --

    Published Online: Jul. 21, 2022

    The Author Email: CHEN Yun-jin (chenyunjin@boe.com.cn)

    DOI:10.37188/cjlcd.2021-0247

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