Coplanarity Inspection Method for Integrated Circuit Pins Based on Single Image

Fupei Wu; Shukai Zhu; Shengping Li

doi:10.3788/AOS202040.0111023

Acta Optica Sinica, Volume. 40, Issue 1, 0111023(2020)

Coplanarity Inspection Method for Integrated Circuit Pins Based on Single Image

Fupei Wu, Shukai Zhu, and Shengping Li^*

Key Laboratory of Intelligent Manufacturing Technology, Ministry of Education, Shantou University, Shantou, Guangdong 515063, China

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Figures & Tables(13)

Fig. 1. Flow chart of monocular vision system

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Fig. 2. Diagram of monocular vision system

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Fig. 3. Model of monocular vision system. (a) Illumination model; (b) simplified model

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Fig. 4. IC diagrams. (a) Original image; (b) red channel; (c) green channel; (d) blue channel

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Fig. 5. Reconstruction result of IC. (a) Sideview of IC; (b) Y direction view of IC

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Fig. 6. Cross-sections of IC. (a) Cross-section of IC solder joints; (b) cross-section of IC pins

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Fig. 7. Laser triangulation^[17]

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Fig. 8. Reconstruction results of IC by using gray superposition method. (a) Sideview of IC; (b) Y direction view of IC

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Fig. 9. Cross-sections of IC by using gray superposition method. (a) Cross-section of IC solder joints; (b) cross-section of IC pins

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Fig. 10. Probability distribution of IC reconstruction results

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Table 1. Effect coefficient of material on light
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Table 1. Effect coefficient of material on light
Calibration point Calibration position f_r f_g f_b
Point 1 (200, 384) 1886 343 1094
Point 2 (225, 384) 1446 275 826
Point 3 (250, 384) 1068 131 812
Point 4 (275, 384) 676 167 397
Point 5 (300, 384) 316 10 225
Mean 1079 185 671

Table 2. 3D detection results of IC solder joints and pinsmm

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Table 2. 3D detection results of IC solder joints and pinsmm

Sampling point	Solder joint of IC	Pin of IC
Sampling point	Actual height (result in Ref. [17])		Experimental height	Error			Actual height (result in Ref. [17])	Experimental height	Error
Point1	0.20	0.22			-0.02	0.46	0.48	-0.02
Point2	0.28	0.23			0.05	0.50	0.48	0.02
Point3	0.24	0.23			0.01	0.44	0.50	-0.06
Point4	0.22	0.23			-0.01	0.42	0.50	-0.08
Point5	0.22	0.23			-0.01	0.52	0.50	0.02
Point6	0.24	0.23			0.01	0.52	0.49	0.03
Point7	0.18	0.17			0.01	0.50	0.50	0
Point8	0.20	0.23			-0.03	0.48	0.48	0
Point9	0.22	0.23			-0.01	0.46	0.49	-0.03
Point10	0.22	0.23			-0.01	0.50	0.48	0.02

Table 3. 3D detection results of IC solder joints and pins based on gray superposition methodmm

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Table 3. 3D detection results of IC solder joints and pins based on gray superposition methodmm

Sampling point	Solder joint of IC	Pins of IC
Sampling point	Actual height (result in Ref. [17])		Experimental height	Error			Actual height (result in Ref. [17])	Experimental height	Error
Point1	0.20	0.32			-0.12	0.46	0.60	-0.14
Point2	0.28	0.32			-0.04	0.50	0.60	-0.10
Point3	0.24	0.32			-0.08	0.44	0.60	-0.16
Point4	0.22	0.32			-0.10	0.42	0.60	-0.18
Point5	0.22	0.32			-0.10	0.52	0.60	-0.08
Point6	0.24	0.32			-0.08	0.52	0.60	-0.08
Point7	0.16	0.32			-0.16	0.50	0.60	-0.10
Point8	0.20	0.32			-0.12	0.48	0.60	-0.12
Point9	0.22	0.32			-0.10	0.46	0.60	-0.14
Point10	0.22	0.32			-0.10	0.50	0.60	-0.10

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Fupei Wu, Shukai Zhu, Shengping Li. Coplanarity Inspection Method for Integrated Circuit Pins Based on Single Image[J]. Acta Optica Sinica, 2020, 40(1): 0111023

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