The microwave transceiver module contains many bare chips. To efficiently remove internal foreign residues after debugging and to improve the production quality and efficiency of such products, a combined cleaning process has been introduced. This process involves plasma cleaning to activate the chip surfaces, followed by a two-fluid cleaning technique. Theoretical analysis and experimental test results show that, compared to traditional manual cleaning methods, this process effectively removes internal foreign materials without causing adverse effects and improves cleaning efficiency by a factor of 22. The cleaned products meet the process requirements specified in the Microelectronics Device Experimental Methods and Procedures （GJB548C-2021）. Based on the process method presented in this study, an effective cleaning solution is provided for removing residual foreign matter in microwave transceiver components with complex internal cavity structures.