Fig. 1. Different welding modes in laser micro welding^[18]. (a) Heat conduction welding; (b) deep penetration welding

Fig. 2. Variation of penetration depth in laser micro welding with laser power and welding speed^[19-20]

Fig. 3. Influence of different processing environments on weld morphology under laser micro welding. (a) Morphology of weld under with and without shielding gas^[27]; (b) weld morphology under different pressure^[28]

Fig. 4. Weld morphology of different scanning methods under laser micro welding^[32]. (a)‒(c) Circumcision scan; (d)‒(f) linear scan

Fig. 5. Weld morphology under different defocusing amount under laser micro welding^[33]. (a) Weld morphology in positive defocusing state; (b) weld morphology in negative defocus state

Fig. 6. Welding morphology of laser micro-welded NiTi SMA^[38]

Fig. 7. Microscopic images of laser micro-welded nanostructures^[40-41]. (a) Laser micro welding of gold nanoparticles; (b) laser micro welding nano-tip

Fig. 8. Applications of laser micro welding technology in transparent materials^[50-51]

Fig. 9. Schematic of laser soldering technology^[54]

Fig. 10. Influence of laser power and welding time on solder spread area under laser soldering^[56]

Fig. 11. Influence of welding speed on welding strength under laser soldering^[59]

Fig. 12. Laser soldering of QFP devices^[65]. (a) Finite element simulation welding temperature field model; (b) welding effect diagram of laser soldering technology

Fig. 13. Microstructure morphology of solder joints under different processing methods^[69]. (a) Infrared reflow welding; (b) diode-laser soldering

Fig. 14. Application of laser soldering in lead-free solder^[76]

Fig. 15. Influence of different content of Zn in SnAgCu solder on soldering strength^[82]

Fig. 16. Sectional view of cable connection device^[85]. (a) Laser soldering cable device; (b) microstructure diagram of solder paste and metal connection

Fig. 17. Principle of laser soldering bumping technology^[86]

Fig. 18. Changes of solder ball morphology under different parameters during laser soldering bumping^[91]. (a) Pit defect; (b) offset defect; (c) ablation defect; (d) qualified appearance

Fig. 19. Two different scanning methods^[95]. (a) Cross scan method; (b) linear scanning method