Laser & Optoelectronics Progress, Volume. 56, Issue 4, 041401(2019)
Coherent Beam Combining Based on High Filling Factor Array with New Sub-Aperture Shape
Fig. 1. Three filling schemes with different sub-aperture shapes. (a) Circle; (b) hexagon; (c) combination
Fig. 2. Relationship between transmission power ratio and truncation coefficient. (a) Hexagon; (b) cut sector
Fig. 3. Relationship between BPF and truncation coefficient for splicing schemes with different shapes
Fig. 4. Near-field and far-field patterns simulated based on three sub-aperture splicing schemes. (a) Near-field pattern for 7 circles; (b) near-field pattern for 7 hexagons; (c) near-field pattern for 7 combination; (d) 3D far-field pattern for 7 circles; (e) 3D far-field pattern for 7 hexagons; (f) 3D far-field pattern for 7 combination; (g) 2D far-field pattern for 7 circles; (h) 2D far-field pattern for 7 hexagons; (i) 2D far-field pattern for 7 combination
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Jiachao Xi, Dong Zhi, Yanxing Ma, Lei Si. Coherent Beam Combining Based on High Filling Factor Array with New Sub-Aperture Shape[J]. Laser & Optoelectronics Progress, 2019, 56(4): 041401
Category: Lasers and Laser Optics
Received: Jul. 23, 2018
Accepted: Sep. 4, 2018
Published Online: Jul. 31, 2019
The Author Email: Lei Si (w_zt@163.com)