Optics and Precision Engineering, Volume. 19, Issue 9, 2154(2011)

Intelligent detection of solder joints on printed circuit boards

XIE Hong-wei*, ZHANG Xian-min, KUANG Yong-cong, and OUYANG Gao-fei
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  • [in Chinese]
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    References(14)

    [1] [1] KUANG J H, HSU CH M, CHIU W CH, et al.. The variation of shear strength of the lead free Sn/3.0Ag/0.5Cu solder balls[C]. IEEE Proceedings of the ninth Electronics Packaging Technology Conference, Singapore, 2007:910-913.

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    [4] [4] CHIU S N, PERN M H. Reflection-area-based feature descriptor for solder joint inspection [J]. Machine Vision and Applications. 2007,8:95-106.

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    [6] [6] XIE H W, KUANG Y C, ZHANG X M. A High Speed AOI Algorithm for Chip Component Based on Image Difference[C]. IEEE International Conference of Information & Automation, Zhuhai, China, 2009(4):969-974.

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    [8] [8] KUK W K, HYUNG S C. Solder Joints Inspection Using a Neural Network and Fuzzy Rule-Based Classification Method [J]. IEEE Transactions on Electronics Packaging Manufacturing, 2000,39(2):93-103.

    [9] [9] LU SH L, ZHANG X M, KUANG Y C. Neural Network Based Inspecting Method of PCB Solder Joint [J]. Journal of South China University of Technology (Natural Science Edition), 2008, 36(5):135-139.(in Chinese)

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    XIE Hong-wei, ZHANG Xian-min, KUANG Yong-cong, OUYANG Gao-fei. Intelligent detection of solder joints on printed circuit boards[J]. Optics and Precision Engineering, 2011, 19(9): 2154

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    Paper Information

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    Received: Jan. 10, 2011

    Accepted: --

    Published Online: Oct. 11, 2011

    The Author Email: XIE Hong-wei (xhw_cn@foxmail.com)

    DOI:10.3788/ope.20111909.2154

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