Laser & Optoelectronics Progress, Volume. 58, Issue 5, 0500008(2021)

Research Progress of Laser Application in Material Removal

Xiaodong Hu1,2、*, Yuanlong Li1,2, Shaozhuang Bai1,2, and Ke Ma1,2
Author Affiliations
  • 1College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou , Zhejiang 310023, China
  • 2Key Laboratory of Special Purpose Equipment and Advanced Processing Technology, Ministry of Education and Zhejiang Province, Hangzhou , Zhejiang 310023, China
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    Figures & Tables(10)
    Schematics of laser drilling method[3]. (a) Copy method(single pulse); (b) copy method(multi-pulse); (c) contour detour(circumferential cut); (d) contour detour(screw-type)
    Laser cutting schematic[11]
    Laser beam parallel cutting diagram[21]
    Laser ablation effect images[24]. (a) Nanosecond laser; (b) picosecond laser; (c) femtosecond laser
    Cantilever beam rendering[29]
    Schematic of lignin laser lithography technique[32]
    Stainless steel splash illustration[33]. (a) No electromagnetic field; (b) steady magnetic field; (c) rotating magnetic field; (d) steady electromagnetic field; (e) rotating electromagnetic field
    Laser waterjet schematic[35]
    Schematic of electromagnetic field assisted laser groove processing device[36]
    Schematic of physical process of groove forming[36]. (a) Material temperature rise; (b) material melting; (c) melt discharge; (d) base material cooling
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    Xiaodong Hu, Yuanlong Li, Shaozhuang Bai, Ke Ma. Research Progress of Laser Application in Material Removal[J]. Laser & Optoelectronics Progress, 2021, 58(5): 0500008

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    Paper Information

    Category: Reviews

    Received: Apr. 29, 2020

    Accepted: Jun. 22, 2020

    Published Online: Apr. 19, 2021

    The Author Email: Xiaodong Hu (hooxoodoo@zjut.edu.cn)

    DOI:10.3788/LOP202158.0500008

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