Laser & Optoelectronics Progress, Volume. 58, Issue 5, 0500008(2021)
Research Progress of Laser Application in Material Removal
Fig. 1. Schematics of laser drilling method[3]. (a) Copy method(single pulse); (b) copy method(multi-pulse); (c) contour detour(circumferential cut); (d) contour detour(screw-type)
Fig. 4. Laser ablation effect images[24]. (a) Nanosecond laser; (b) picosecond laser; (c) femtosecond laser
Fig. 7. Stainless steel splash illustration[33]. (a) No electromagnetic field; (b) steady magnetic field; (c) rotating magnetic field; (d) steady electromagnetic field; (e) rotating electromagnetic field
Fig. 9. Schematic of electromagnetic field assisted laser groove processing device[36]
Fig. 10. Schematic of physical process of groove forming[36]. (a) Material temperature rise; (b) material melting; (c) melt discharge; (d) base material cooling
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Xiaodong Hu, Yuanlong Li, Shaozhuang Bai, Ke Ma. Research Progress of Laser Application in Material Removal[J]. Laser & Optoelectronics Progress, 2021, 58(5): 0500008
Category: Reviews
Received: Apr. 29, 2020
Accepted: Jun. 22, 2020
Published Online: Apr. 19, 2021
The Author Email: Xiaodong Hu (hooxoodoo@zjut.edu.cn)