Journals Articles Conferences News About CLP
Submit a paper Email Alert
Search
Search
Articles
Journals
News
Advanced Search
Top Searches
2D MaterialsTransformation opticsQuantum PhotonicsSmall lasersSemiconductor UV PhotonicsSupersymmetric microring laser arrays

Opto-Electronic Engineering, Volume. 40, Issue 5, 138(2013)

Analysis of Curing Stress Magnitude about Low Stress Optical Structure Adhesives under Stable Temperature

LIAO Jiasheng1,2、*, GONG Yan1, YUAN Wenquan1, and LUO Cong1,2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
    • show less
    AbstractGet PDF
    Figures&Tables (0)
    Equations (0)
    References (8)
    Tools
    Paper Information
    Topics
    Figures & Tables(0)
    Tools

    Get Citation

    Copy Citation Text

    LIAO Jiasheng, GONG Yan, YUAN Wenquan, LUO Cong. Analysis of Curing Stress Magnitude about Low Stress Optical Structure Adhesives under Stable Temperature[J]. Opto-Electronic Engineering, 2013, 40(5): 138

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Set citation alerts for article
    Save article for my favorites
    Paper Information

    Received: Dec. 18, 2012

    Accepted: --

    Published Online: May. 24, 2013

    The Author Email: Jiasheng LIAO (expore07@163.com)

    DOI:10.3969/j.issn.1003-501x.2013.05.020

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology