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Microelectronics, Volume. 55, Issue 4, 690(2025)

Research on Spatter of Solder Bead in Vacuum Reflow Soldering Circuits

FANG Yazhou, ZHOU Chengbin, ZHENG Xu, and CHANG Maochun
Author Affiliations
  • The 24th Research Institute of China Electronics Technology Group Corp, Chongqing 400060, P R China
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    FANG Yazhou, ZHOU Chengbin, ZHENG Xu, CHANG Maochun. Research on Spatter of Solder Bead in Vacuum Reflow Soldering Circuits[J]. Microelectronics, 2025, 55(4): 690

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    Paper Information

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    Received: Nov. 7, 2024

    Accepted: Sep. 9, 2025

    Published Online: Sep. 9, 2025

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.240403

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology