Tin bead spatter is a common defect in the vacuum reflow process. By analyzing its causes, two main factors contributing to tin bead spatter have been identified: the quality of the component's coating and the minimum vacuum level. By pretreating the components to allow impurities in the coating to fully escape, using step-by-step vacuum pumping, dynamically adjusting the minimum vacuum level, or reducing the vacuum rate to slowly remove bubbles from the molten solder, the incidence of tin bead spatter can be effectively reduced.