High Power Laser and Particle Beams, Volume. 34, Issue 3, 031018(2022)

Analysis of thermal effect of high-power semiconductor laser spectral combining grating

Bowen Fu1,2, Qinnan Zhang1,2, Yong Tian1, and Jindong Tian1,2、*
Author Affiliations
  • 1College of Physics and Optoelectronic Engineering, Shenzhen University, Shenzhen 518061, China
  • 2Research Institute of Laser Processing Technology and Intelligent Manufacturing, Shenzhen 518107, China
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    Figures & Tables(11)
    Schematic diagram of laser structure
    Periodic structure of diffraction grating
    The geometric model of the diffraction grating substrate
    Flow chart of high-power semiconductor laser spectrum combining COMSOL implementation
    Light thermal simulation results
    Stress and deformation nephogram at 10 min
    Variation curves of stress and deformation at the center of diffraction grating with different thickness
    Grating surface deformation in each direction and −1 order diffraction efficiency variation curves
    Simulation results of beam angle and position offset
    • Table 1. Periodic boundary parameters of wire grid unit

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      Table 1. Periodic boundary parameters of wire grid unit

      grating period d/nm microstructure height h/nm microstructure width w/nm air refractive index n0incident angle θ/(°)
      625.01725.0400.01.0θi(i=1,2,3,4,5)
    • Table 2. Physical parameters of common diffraction grating substrate materials

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      Table 2. Physical parameters of common diffraction grating substrate materials

      materialnκk/[W·(m·K)−1] ρ/kg·m−3Cp/[J·(kg·K)] α/K−1E/MPa μ
      quartz glass1.5082.89×10−81.3822037035.5×10−77.31×1040.17
      Y3Al5O121.81611.0645511582.76.94×10−62.86×1050.25
      Si(100)3.5797.49×10−4152.462330707.122.57×10−61.31×1050.28
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    Bowen Fu, Qinnan Zhang, Yong Tian, Jindong Tian. Analysis of thermal effect of high-power semiconductor laser spectral combining grating[J]. High Power Laser and Particle Beams, 2022, 34(3): 031018

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    Paper Information

    Category: Laser Numerical Simulation

    Received: Oct. 6, 2021

    Accepted: Nov. 11, 2021

    Published Online: Mar. 28, 2022

    The Author Email: Jindong Tian (jindt@szu.edu.cn)

    DOI:10.11884/HPLPB202234.210271

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