Researching | Novel vision on-the-fly system for flip chip bonder

Opto-Electronic Engineering, Volume. 34, Issue 7, 80(2007)

Novel vision on-the-fly system for flip chip bonder

[in Chinese], [in Chinese], [in Chinese], and [in Chinese]

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[in Chinese]

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References(3)

[3] [3] Edison T.Hudson.Method and apparatus for reflective in-flight component registration[P].United States Patent:5768759,1998.

[4] [4] Edison T.Hudson.One camera system for component to substrate registration[P].United States Patent:20010055069,2001.

[5] [5] Daniel Link.Appratus for mounting a flipchip on a work piece[P].United Stated Patent:6530146,2003.

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[2] QI Zhan-hui, ZHANG Suo-ping. Non-calibration Points Algorithm for the Image Correction[J]. Opto-Electronic Engineering, 2009, 36(1): 31

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[in Chinese], [in Chinese], [in Chinese], [in Chinese]. Novel vision on-the-fly system for flip chip bonder[J]. Opto-Electronic Engineering, 2007, 34(7): 80

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Paper Information

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Received: Jul. 21, 2006

Accepted: --

Published Online: Nov. 14, 2007

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Topics

laser devices and laser physics

Lasers and Laser Optics

laser manufacturing

Instrumentation, Measurement and Metrology