Thermal Analysis of High-Power LED Lens

Dandan Xu; Xuegong Hu

doi:10.3788/AOS201939.1023001

Acta Optica Sinica, Volume. 39, Issue 10, 1023001(2019)

Thermal Analysis of High-Power LED Lens

Dandan Xu¹ and Xuegong Hu^1,2、*

¹Research Center for Heat and Mass Transfer, Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing 100190, China

²University of Chinese Academy of Sciences, Beijing 100049, China

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References(15)

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[7] Li J S, Yang Q X, Niu P J et al. Analysis of thermal field on integrated LED light source based on COMSOL multi-physics finite element simulation[J]. Physics Procedia, 22, 150-156(2011). http://www.sciencedirect.com/science/article/pii/S187538921100678X

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[9] Juntunen E, Tapaninen O, Sitomaniemi A et al. Effect of phosphor encapsulant on the thermal resistance of a high-power COB LED module[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 3, 1148-1154(2013). http://ieeexplore.ieee.org/document/6523062/

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Dandan Xu, Xuegong Hu. Thermal Analysis of High-Power LED Lens[J]. Acta Optica Sinica, 2019, 39(10): 1023001

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Paper Information

Category: Optical Devices

Received: Apr. 22, 2019

Accepted: Jun. 24, 2019

Published Online: Oct. 9, 2019

The Author Email: Hu Xuegong (xuegonghu@iet.com)

DOI:10.3788/AOS201939.1023001

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology