[1] [1] Yang Xiaodong, Wu Songhua, Song Yinghong. Research progress of polymer-based thermally conductive electronic packaging materials[J]. Adhesion, 2012(2): 75-79. (in Chinese)

[2] [2] Niu Ligang. Thermal reliability analysis for QFN based on factorial experimental design[J]. Equipment for Electronic Products Manufacturing, 2009, 9(8): 46-50. (in Chinese)

[3] [3] Quan Yanming, Zhao Jing, Li Yiping. Surface emissivity calibration for metal cutting tool and workpiece materials with infrared imager[J]. Journal of Mechanical Engineering, 2009, 45(12): 182-185. (in Chinese)

[4] [4] Arriola I, Whitenton E, Heigel J, et al. Relationship between machinability index and in-process parameters during orthogonal cutting of steels[J]. CIRP Annals-Manufacturing Technology, 2011, 60(1): 93-96.

[5] [5] Davies M A, Ueda T, M′saoubi R, et al. On the measurement of temperature in material removal processes[J]. CIRP Annals-Manufacturing Technology, 2007, 56(2): 581-604.

[6] [6] Skouroliakou A S, Seferis I, Sianoudis I, et al. Infrared thermography imaging: evaluating surface emissivity and skin thermal response to IR heating[J]. E-Journal of Science & Technology, 2014, (11): 85.

[7] [7] Herve P, Cedelle J, Negreanu I. Infrared technique for simultaneous determination of temperature and emissivity[J]. Infrared Physics & Technology, 2012, 55(1): 1-10.

[8] [8] Hu Jianhong, Ning Fei, Shen Xiangheng. Influence of surface emissivity of objects onmeasuring accuracy of infrared thermal imagers[J]. Chinese Journal of Optics and Applied Optics, 2010, 3(2): 152-156. (in Chinese)

[9] [9] Yang Li, Yang Zhen. Infrared Thermal Imaging Principle and Technology[M]. Beijing: Science Press, 2012. (in Chinese)

[10] [10] Zhang Kaihua, Yu Kun, Zhang Feng, et al. Experimental investigation of infrared spectral emissivity of copper at 300-1 123 K[J]. Spectroscopy and Spectral Analysis, 2015, 35(8): 2159-2163. (in Chinese)