Microstructure and Mechanism of Copper Layer Processed with Laser Remelting and Electrochemical Deposition Interaction Process

Tingchao Xiong; Yanyi Yin; Danhua Lu; Guolong Wu; Ye Wang; Jianhua Yao

doi:10.3788/CJL220615

Chinese Journal of Lasers, Volume. 50, Issue 4, 0402007(2023)

Microstructure and Mechanism of Copper Layer Processed with Laser Remelting and Electrochemical Deposition Interaction Process

Tingchao Xiong^1,2,3, Yanyi Yin^1,2,3, Danhua Lu^1,2,3, Guolong Wu^1,2,3、*, Ye Wang^1,2,3, and Jianhua Yao^1,2,3

Author Affiliations

¹School of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, Zhejiang , China

²Laser Advanced Manufacturing Research Institute, Zhejiang University of Technology, Hangzhou 310023, Zhejiang , China

³High-End Laser Manufacturing Equipment Province and Ministry Jointly Established Collaborative Innovation Center, Hangzhou 310023, Zhejiang , China

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Tingchao Xiong, Yanyi Yin, Danhua Lu, Guolong Wu, Ye Wang, Jianhua Yao. Microstructure and Mechanism of Copper Layer Processed with Laser Remelting and Electrochemical Deposition Interaction Process[J]. Chinese Journal of Lasers, 2023, 50(4): 0402007

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Paper Information

Category: laser manufacturing

Received: Mar. 1, 2022

Accepted: May. 26, 2022

Published Online: Feb. 7, 2023

The Author Email: Wu Guolong (glwu@zjut.edu.cn)

DOI:10.3788/CJL220615

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology