Chinese Journal of Lasers, Volume. 52, Issue 12, 1202404(2025)
Preparation of Low‑Resistance Microscale Three‑Dimensional Copper Structures via Laser‑Induced Forward Transfer Combined with Electroless Plating
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Pengfei Yang, Bingjun Luo, Zhiheng Wu, Xinhong Su, Liang Li, Likui Jin, Jiangyou Long. Preparation of Low‑Resistance Microscale Three‑Dimensional Copper Structures via Laser‑Induced Forward Transfer Combined with Electroless Plating[J]. Chinese Journal of Lasers, 2025, 52(12): 1202404
Category: Laser Micro-Nano Manufacturing
Received: Nov. 28, 2024
Accepted: Jan. 21, 2025
Published Online: May. 22, 2025
The Author Email: Jiangyou Long (longjy@gdut.edu.cn)
CSTR:32183.14.CJL241400