Preparation of Low‑Resistance Microscale Three‑Dimensional Copper Structures via Laser‑Induced Forward Transfer Combined with Electroless Plating

Pengfei Yang; Bingjun Luo; Zhiheng Wu; Xinhong Su; Liang Li; Likui Jin; Jiangyou Long

doi:10.3788/CJL241400

Chinese Journal of Lasers, Volume. 52, Issue 12, 1202404(2025)

Preparation of Low‑Resistance Microscale Three‑Dimensional Copper Structures via Laser‑Induced Forward Transfer Combined with Electroless Plating

Pengfei Yang¹, Bingjun Luo^1,2, Zhiheng Wu³, Xinhong Su⁴, Liang Li⁴, Likui Jin⁴, and Jiangyou Long^1、*

Author Affiliations

¹School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, Guangdong , China

²Guangdong Engineering Technology Research Center of Intelligent Inspection and Laser Precision Repair, Guangdong Greatsense Intelligent Equipment Co. Ltd., Guangzhou 510700, Guangdong , China

³Universal Circuit Board Equipment Co. Ltd., Dongguan 523000, Guangdong , China

⁴Zhuhai Founder Technology High Density Electronic Co. Ltd., Zhuhai 519000, Guangdong , China

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Pengfei Yang, Bingjun Luo, Zhiheng Wu, Xinhong Su, Liang Li, Likui Jin, Jiangyou Long. Preparation of Low‑Resistance Microscale Three‑Dimensional Copper Structures via Laser‑Induced Forward Transfer Combined with Electroless Plating[J]. Chinese Journal of Lasers, 2025, 52(12): 1202404

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