Infrared and Laser Engineering, Volume. 54, Issue 7, 20250115(2025)

Micro-transfer printing for heterogeneous integration of photonic devices (invited)

Mingxin ZHANG, Xiaoya LIU, Jiacheng ZHOU, Junpeng LU, Zhenhua NI, and Junjia WANG
Author Affiliations
  • National Research Center for Optical Sensors/Communications Integrated Networks, School of Electronic Science and Engineering, Southeast University, Nanjing 210096, China
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    Figures & Tables(7)
    (a) Illustration of micro-transfer printing by anisotropic wet etching[30]; (b) Silicon photonics chip using transfer printing with BCB[26]; (c) Schematic of transfer printing using capillary bonding[31]
    (a) Illustration and optical images of the graphene-assisted micro-transfer printing process[35]; (b) Transfer of metals including Cu, Ag, Au, Pt, Ti and Ni on SiO2[35]
    (a) Illustration of the laser-assisted micro-transfer printing process[36]; (b) The device printed onto steel sphere, glass hemisphere, dry petal[36]; (c) Schematic diagram of the principle of morphological change of a hierarchical stamp[37]
    (a) Schematic layout of the integrated tunable laser cavity design[42]; (b) Wavelength tuning behavior of the widely tunable laser[42]; (c) Schematic layout of the III-V-on-Si laser[43]; (d) Wavelength tuning behavior of the III-V-on-Si laser[43]
    (a) Micrographs of the transfer-printed waveguide photodetector[44]; (b) Dark current changes before and after transfer[44]; (c) Illustration of the p-i-n photodiode on top of a SiN waveguide[45]; (d) Responsivity and quantum efficiency of device at 800 nm and 775 nm wavelengths[45]
    (a) Schematic image of the micro-transfer printed thin film lithium niobate ring modulator[46]; (b) Optical transmission at various applied voltages[46]; (c) Optical transmission of MZI before and after transferring BTO layer[49]; (d) Phase change at different voltages[49]; (e) Schematic of the tri-layer adiabatic transition [50]; (f) Eye diagrams for 112 GBd NRZ and 180 GBd NRZ[50]
    • Table 1. A comparison of wafer-level heterogeneous integration approaches

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      Table 1. A comparison of wafer-level heterogeneous integration approaches

      TechnologyIntegrateddensityAlignmentaccuracyCMOS compatibilityIntegrated efficiencyCostMaturity
      Flip-chipLowMediumBack-end compatibleMediumHighMature
      Wafer bondingMediumHighBack-end compatibleMediumHighMature
      Epitaxial growthHighMediumFront-end compatibleHighMediumR&D
      Micro-transfer printingHighHighBack-end compatibleVery highLowR&D
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    Mingxin ZHANG, Xiaoya LIU, Jiacheng ZHOU, Junpeng LU, Zhenhua NI, Junjia WANG. Micro-transfer printing for heterogeneous integration of photonic devices (invited)[J]. Infrared and Laser Engineering, 2025, 54(7): 20250115

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    Paper Information

    Category: Micro-nano optics and photon integration

    Received: Feb. 19, 2025

    Accepted: --

    Published Online: Aug. 29, 2025

    The Author Email:

    DOI:10.3788/IRLA20250115

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