Fig. 1. Application fields of laser precision machining. (a) Laser precision cutting; (b) laser fabricating function surface; (c) laser precision welding; (d) laser marking; (e) laser polishing; (f) laser 　drilling

Fig. 2. New technology of laser precision polishing^[26-27]. (a) Simulation analysis of polishing mechanism: (a-1) temperature field distribution of workpiece, (a-2) molten pool temperature, (a-3) molten pool flow, (a-4) element segregation inhibition mechanism; (b) polishing process implementation: (b-1) polishing strategy planning, (b-2) artificial neural network training model, (b-3) additive curved workpiece polishing, (b-4) additive dental implant polishing; (c) laser polished surface quality: (c-1) SEM image of laser polished and as-received surfaces, (c-2) CLSM image of laser polished surface, (c-3) CLSM image of as-received additive surface, (c-4) CT scan image of as-received additive part cross-section porosity, (c-5) CT scan image of polished part cross-section porosity; (d) microstructure and properties of polished layer: (d-1) polished layer cross-section, (d-2) TEM image of polished layer microstructure, (d-3) compressive yield 　strength of polished part

Fig. 3. Performance analysis of laser joining produced Ti6Al4V-PA66/GF30 joints^[31]. (a) Schematic of laser joining process; (b) cross-sectional morphology at joining interface of Ti6Al4V-PA66/GF30 joint; (c) relationship between tensile fracture strength of Ti6Al4V-PA66/GF30 joints and structure density of Ti6Al4V surface; (d) surface (top) and cross-　sectional (bottom) morphologies of fractured joints

Fig. 4. Performance analysis of laser joining produced Ti6Al4V-PEEK/CF30 joint^[32]. (a) Cross-sectional morphology of Ti6Al4V-PEEK/CF30 joints at joining interface; (b) relationship between tensile fracture strength of Ti6Al4V-PEEK/CF30 joints and structure density of Ti6Al4V surface; (c) influence of high-low temperature alternating aging test on 　fracture strength of Ti6Al4V-PEEK/CF30 joint

Fig. 5. Ultra-fast laser preparation of functional surface and performance analysis of the surface^[51]. (a) Ultra-fast laser fabricated regular micropillar structure; (b) hierarchical surface morphology of micropillar structure; (c) superhydrophobicity of micropillar structure; (d) self-clearing performance of fabricated superhydrophobic surfaces on stainless steel; (e) anti-icing performance of fabricated superhydrophobic surfaces on stainless steel in natural 　　environment at －8.5 ℃±0.5 ℃

Fig. 6. Ultra-fast laser preparation of functional surface and its anti-reflection performance^[61]. (a) SEM images of the center of irradiated spots on WC-Co alloy surface; (b) formation diagrams of nano-protrusions between nano-ripples at groove surface; (c) controlling surface reflectance of micro/nano-structured WC-Co alloy surface; (d) surface reflectance of large area nanostructure

Fig. 7. Changes of temperature and chemical composition of ultrafast laser drilling bone^[72]. (a) Real time temperature; (b) temperature change under three conditions; (c) Fourier transform infrared spectra under three conditions; (d) Raman 　spectra under three conditions

Fig. 8. Quality analysis of high efficiency ultrafast laser processed bone holes^[72]. (a-1)－(a-3) Three-dimensional morphologies of bone holes; (b-1)－(b-3) bone debris; (c-1)－(c-3) SEM images of bone holes; (d-1)－(d-3) histological images of bone holes

Fig. 9. On line spectral monitoring of laser drilling process^[72，77]. (a) Plasma spectra; (b) second harmonic spectra；(c) amplified image of plasma spectra during 540－700 nm

Fig. 10. Laser thinning polysilicon^[87]. (a) Heat-affected zone of laser thinned polysilicon; (b) cross-section of laser thinned polysilicon; (c) Raman spectrums of as-received and laser thinned polysilicon surfaces; (d) I-V characteristic curves of 　as-received and laser-thinned polysilicon samples

Fig. 11. Laser polishing single crystal silicon^[88]. (a) Macro-scale surface topography and surface roughness of as-received and laser polished single crystal silicon surfaces; (b) three-dimensional topographic images of as-received and laser polished single crystal silicon surfaces, where Fig. (b-1) is laser-polished surface and Fig. (b-2) is as-received surface; (c) X-ray photoelectron spectroscopy (XPS) of as-received and laser polished single crystal silicon surfaces, where Fig. (c-1) is C1s, Fig. (c-2) is O1s, and Fig. (c-3) is Si2p; (d) X-ray diffraction (XRD) spectra of as-received and laser-polished single crystal silicon surfaces; (e) Raman spectra of as-received and laser-polished single crystal silicon surfaces; (f) I-V 　characteristic curves of as-received and laser-polished single crystal silicon

Fig. 12. Hybrid laser grinding single crystal silicon^[86]. (a) Surface topography of as-received and laser grinded single crystal silicon samples; (b) XRD spectra of as-received and laser grinded single crystal silicon surfaces; (c) Raman spectra of as-received and laser grinded single crystal silicon surfaces