Chinese Journal of Lasers, Volume. 34, Issue 11, 1589(2007)

Analysis of Silicon Surface Profile of Pulsed Laser Bending Processing

[in Chinese]*, [in Chinese], [in Chinese], [in Chinese], [in Chinese], and [in Chinese]
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    References(7)

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    [6] [6] U. Lschner, H. Exner,E. Grtner et al.. Laser bending of silicon [C]. SPIE, 2003, 4977:86~93

    [7] [7] H. Exner, U. Lschner. Contactless laser bending of silicon microstructures [C]. SPIE, 2003, 5116:383~392

    [8] [8] X. Richard Zhang, Xianfan Xu. Finite element analysis of pulsed laser bending: the effect of melting and solidification [J]. J. Appl. Mechanics, 2004, 71(3):321~326

    [9] [9] X. Richard Zhang, Xianfan Xu. Laser bending for high-precision curvature adjustment of micro cantilevers [J]. Appl. Phys. Lett., 2005, 86(2):021114-1~021114-4

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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Analysis of Silicon Surface Profile of Pulsed Laser Bending Processing[J]. Chinese Journal of Lasers, 2007, 34(11): 1589

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    Paper Information

    Category: laser manufacturing

    Received: May. 22, 2007

    Accepted: --

    Published Online: Nov. 12, 2007

    The Author Email: (djwudut@dlut.edu.cn)

    DOI:

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