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Laser & Infrared, Volume. 55, Issue 5, 643(2025)

Review of scribing and dicing methods for silicon carbide wafers

LIU Fu1,2, ZHOU Yu-biao1,2, YAN Si-yuan1,2, CHENG Qi-ren1,2, and ZHANG Yi1,2、*
Author Affiliations
  • 1State Key Laboratory of Advanced Design and Manufacturing Technology for Vehicle, Hunan University, Changsha 410082, China
  • 2Key Laboratory for Intelligent Laser Manufacturing of Hunan Province, Hunan University, Changsha 410082, China
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    LIU Fu, ZHOU Yu-biao, YAN Si-yuan, CHENG Qi-ren, ZHANG Yi. Review of scribing and dicing methods for silicon carbide wafers[J]. Laser & Infrared, 2025, 55(5): 643

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    Paper Information

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    Received: Jul. 17, 2024

    Accepted: Jul. 11, 2025

    Published Online: Jul. 11, 2025

    The Author Email: ZHANG Yi (zy@hnu.edu.cn)

    DOI:10.3969/j.issn.1001-5078.2025.05.001

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology