Chinese Journal of Lasers, Volume. 52, Issue 8, 0802406(2025)
Cracking Behavior and Gradient Power Processing Strategy in Ultrafast Laser Processing of Hard and Brittle Materials
Fig. 2. Crack extension behavior. (a) Cracks are generated by melt solidification at the bottom of the hole; (b) cracks at the bottom of the hole expand outward; (c) cracks start to surround the microholes; (d) cracks are connected and interlaced
Fig. 3. Comparison graphs of single power machining (Ep: laser energy).(a1)‒(a3) Processing 5, 10 and 13 times at 17 W power, respectively; (b1)‒(b3) processing 5, 10 and 13 times at 14.5 W power, respectively; (c1)‒(c3) processing 5, 10 and 13 times at 8 W power, respectively
Fig. 4. Comparison of gradient power machining. (a) Processing 5 times at 17 W power; (b) processing 5 times at 14.5 W + processing 5 times at 17 W power; (c) processing 5 times at 8 W + processing 5 times at 17 W power; (d) processing 5 times at 8 W power + processing 5 times at 14.5 W power + processing 3 times at 17 W power
Fig. 5. In-situ temperature measurement during processing. (a) Schematic diagram of the temperature measurement and characterization of material surface roughness variation; (b) 5 cycles of scanning processing at 17 W power; (c) 5 cycles of scanning processing at 11.5 W power + 3 cycles of scanning processing at 17 W power
Fig. 6. Mechanism of crack formation and extension inhibition by gradient power machining strategy
Get Citation
Copy Citation Text
Yehui Nie, Bowu Zhang, Penghui Zhang, Zhikai Huang, Kuan Zhao, Zhanwen A. Cracking Behavior and Gradient Power Processing Strategy in Ultrafast Laser Processing of Hard and Brittle Materials[J]. Chinese Journal of Lasers, 2025, 52(8): 0802406
Category: Laser Micro-Nano Manufacturing
Received: Oct. 30, 2024
Accepted: Jan. 6, 2025
Published Online: Mar. 19, 2025
The Author Email: Zhanwen A (azw19@tsinghua.org.cn)
CSTR:32183.14.CJL241306